2026 InterPACK Conference & Exhibition

  • Conference
  • Engineering

October 26, 2026 8:00 am — October 29, 2026 5:00 pm

Location:

San Diego, CA

Venue: San Diego Marriott Mission Valley, San Diego, CA

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ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems. Tracks include heterogeneous integration, data centers, extreme-environment packaging, power/RF electronics and photonics, nanoscale heat transfer, flexible/wearable electronics, and intelligent modeling.

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About ASME
ASME is the professional society for mechanical engineers; InterPACK is the flagship conference of its Electronic and Photonic Packaging Division.

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